Assessment of Solder Flux Corrosivity and Flux Residue Level in Clip Bonding Assembly

نویسندگان

چکیده

Abstract Most fluxes and their flux residue are corrosive, presence on the surface of assemblies may cause reliability concerns due to electrochemical migration. This study firstly refers test method IPC-TM-650 2.3.32D 2.6.15C requirements in J-STD-004A evaluate flux-induced corrosion corrosivity residue. Then thermogravimetric analysis is used level after soldering under identical conditions. These comparison data can be utilized compare performance solder pastes. For cleanliness evaluation cleaning, qualitative IPC-A-610G adopts optical inspection observe cleaning effect. The quantitative 2.3.28B ion chromatography analyze ionic species cleaning. In addition method, effectiveness other methods has been well demonstrated characterize clip bonding assembly.

برای دانلود رایگان متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Root Cause Analysis of Solder Flux Residue Incidence in the Manufacture of Electronic Power Modules

This work investigates the root causes of the incidence of solder flux residue underneath electronic components in the manufacture of power modules. The existing deionized water-based centrifugal cleaning process was analyzed and hypotheses for root causes of the problem were proposed. The experimentation included cleaning tests using agitation and soak cycles. Parameters such as chemical agent...

متن کامل

high-flux and low-flux membranes: efficacy in hemodialysis

results the mean kt/v was 1.27 ± 0.28 in high-flux and 1.10 ± 0.32 in low-flux membrane which, these differences were statistically significant (p = 0.017). the mean of urr was 0.65 ± 0.09 in high-flux and 0.61 ± 0.14 in low-flux membrane, which these differences were not statistically significant (p = 0.221). patients and methods forty hemodialysis patients participated in this cross-over clin...

متن کامل

Flux creep and flux jumping.

The flux jump instability of Bean’s critical state in the flux-creep regime of type-II superconductors is considered. We find the flux-jump field B j which determines stability criterion of the superconducting state. The dependence of B j on the external magnetic-field ramp rate Ḃe is calculated. We demonstrate that under the conditions typical for most of the magnetization experiments the slop...

متن کامل

assessment of deep word knowledge in elementary and advanced iranian efl learners: a comparison of selective and productive wat tasks

testing plays a vital role in any language teaching program. it allows teachers and stakeholders, including program administrators, parents, admissions officers and prospective employers to be assured that the learners are progressing according to an accepted standard (douglas, 2010). the problems currently facing language testers have both practical and theoretical implications but the first i...

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

ژورنال

عنوان ژورنال: Proceedings of the ... International Symposium on Microelectronics

سال: 2021

ISSN: ['1085-8024']

DOI: https://doi.org/10.4071/1085-8024-2021.1.000314